October 25th, 2011, the IPC Technical Seminars which has the theme of "Innovation-driven, Transition, Development, and
Cutting edge Electronic Assembly Technology" was held in the industrial park hall of King Brother Technology Group in
Huizhou, to which many mainstream media like the SMT China, PCB Domain, Printed Circuit Information and International
Electronic Business all paid great attention. Chairman Yan Yongnong held a lecture named " Challenges and Opportunities
Facing Through-hole Welding Process--the Solution to Through-hole Welding of Shenzhen Kunqixinhua Technology
Co., Ltd. " Chairman Wu Shoukun from King Brother Technology Group, vice director Dr. Li Xinzhu from SGS-CSTC, Miss
He Guanghui from China CEPREI Laboratory, and senior engineer Mr. Chen Dongsheng from Huawei Group and other ten
elites in the electronic manufacturing field were jointly invited.
The lecture was mainly on the functions and benefits of our new equipment, new technology in the electronics industry to solve
the current difficulties and technical bottlenecks in the process of welding points. The world's first new technology, so here shocked
many listeners, aroused interest in the speech, and everyone raised their hands to ask for presentations. During coffee breaks there
were several listeners including staff from Haier Group to discuss with Chairman Yan.
During the dinner, the general manager of IPC China Ms. Peng Lixia of IPC Association gave high praise and evaluation on
the lecture by Chairman Yan. She expressed the expectation on our next new technology, and also called for more industry elite
of the electronics manufacturing industry to bring more revolutionary innovation.
Chairman Yan is lecturing
Chairman Yan is answering listener’s questions
The vice president of IPC International Relations presented Chairman Yan
“Distinguished Contribution Award ”
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