ICHIMURA Solder Paste series is developed with technical collaboration between Japan ASH and us. It is a No Clean solder paste developed with special process and fluxes, using low oxide content solder ball.
• Excellent Printing continuity
• Quick stripping and low residue
• Higher insulation
• Smooth, bright and wet solder ball
• RoHs and REACH compliant. Meets HF Environmental Requirements
• Suitable for all products process. |
