Product Function:
1.Welding Quality Improvement: Continuous access can lower the surface extension, enhance the flow ability and wet ability and at last effectively improve the rolled yield.
2.Antioxidant: Initiatively adsorption the free oxygen from liquid tin, at the same time form a protective film in the tin surface, so as to prevent from oxidation. Finally Reduce dross generation and emission of industrial waste.
3.Sustainable utilization of Tin Resource: By physical and chemical way to displace the pure tin out of the tin slag; improve the solder utilization rate (+ 30% ~ 60%); reduce cost and realize sustainable utilization of tin. Resource
Characteristic
. Colorless transparent liquid, macromolecule organic compound, soluble in most organic solvent and water. Compounded by a variety of surfactant, wetting agent, dispersant. High-temperature resistant, volatilize resistance (almost non-volatile in normal temperature)
. Water-soluble, non-flammable, non-corrosive, non-sticky.
. No reaction mixed with flux, no residue on PCB.
. Almost smokeless, tasteless, do not contain any heavy metal components, won't change solder composition.
. Reducing oxygen content in solder, enhance the liquidity and wettability of soldering tin, reduces the surface tension and effectively improve the soldering quality of PCBA.
. Product does not contain any banned substances ingredients, such as: PFoA+PFOS+SB, benzotriazole; TBBP-A; asbestos; formaldehyde; accord wiith ROHS/REACH standard.
. Reaction residue is muddy shape; cohesionless; water-soluble or biodegradation. The equipment daily maintenance is simple. From the point of view of environmental protection for enterprise to save energy and reduce consumption.
. Reduction rate is high, 1KG can reduces 30 ~ 50KG tin slag.
. Long time last; add one time can maintain 4-6 hours; reduce manpower.
. Products through tough SIR/electrical migration/slice related testing that verifies the real product for environmental protection and energy saving.
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